BIRTH OF CMP


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BIRTH OF CMP
BIRTH OF CMPCMP was originally adapted from the lapping process used to polish plate glass. The original commercial practice of CMP in the semiconductor industry was to prepare raw silicon wafers. After the wafer was sawed from a single-crystal silicon rod, the mechanically damaged surface layer was removed and the surface planarized to produce a flat, scratch-free surface for VLSI devices and circuits. The wafer to be polished is mounted on a wafer carrier via back pressure or via surface tension by wetting its back surface. The wafer is pressed down against a rotating platen, which holds a compliant polishing pad. The wafer slides on the pad surface with a relative velocity generated by the rotation of the carrier and the platen [7…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. BIRTH OF CMP, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export