REFERENCES


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REFERENCES
REFERENCES H. Deligianni et al., "A Model of Superfilling in Damascene Electroplating," Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, edited by P. C. Andricacos, P. C. Searson, C. Reidsema-Simpson, P. Allongue, J. L. Stickney, and G. M. Oleszek, ECS, Pennington, NJ, pp. 52–60, 1999. K. Takahashi and M. Gross, "Transport Phenomena That Control Electroplated Copper Filling of Submicron Vias and Trenches," J. ECS, Vol. 146, No. 12, pp. 4499–4503, 1999. T. P. Moffat et al., "Superconformal Electrodeposition of Copper,"
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. REFERENCES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export