SUMMARY


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SUMMARY
SUMMARYSemiconductor manufacturers continually strive to make smaller, faster chips by minimizing line resistance, feature sizes, and dielectric constants. As features shrink, the local current densities increase, creating issues with electromigration. Copper interconnects provide lower resistance and improved electromigration lifetimes relative to aluminum. To implement copper in production, manufacturers have switched to a damascene processing sequence that uses copper electroplating to fill submicrometer features. ECD prevents void formation in the deposition process by combining organic additives and electrolytic deposition parameters to produce high-yielding, reliable interconnects. To maintain consistent performance, the plating bath additives are periodically analyzed and replenished with automated che…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SUMMARY, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export