FUTURE TRENDS


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FUTURE TRENDS
FUTURE TRENDSWith each technology node, interconnect size decreases and the current density in interconnects increases. According to the International Technology Roadmap for Semiconductors, the current density approximately doubles from the 130- to 45-nm node technology.21 As feature sizes become smaller, the percentage of the interconnect filled by the barrier layer becomes more significant. In addition to this, the size of the interconnect feature is approaching the electron mean free path in copper. This causes the resistivity to increase due to surface scattering of electrons. To minimize line resistance and maximize electromigration lifetime, alternative materials are being investigated and integra…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. FUTURE TRENDS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export