CONFORMAL CVD FILMS AND VOID-FREE FEATURE FILLING


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CONFORMAL CVD FILMS AND VOID-FREE FEATURE FILLING
CONFORMAL CVD FILMS AND VOID-FREE FEATURE FILLING
General Considerations The continued down-sizing of trenches and other features in microelectronics processing over the last four decades has resulted in very high aspect ratio (AR) features, where the aspect ratio—the ratio of trench height to width—can exceed 10:1 [37]. As shown schematically in Fig. 12.3a, diffusion of the precursor into the trench typically yields a higher precursor concentration at the top of the trench than at the bottom (
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. CONFORMAL CVD FILMS AND VOID-FREE FEATURE FILLING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export