LAYERS DEPOSITED USING SPUTTERING


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LAYERS DEPOSITED USING SPUTTERING
LAYERS DEPOSITED USING SPUTTERINGSputtering allows the deposition of almost any kind of material. It allows the deposition of a free choice of metals, including those with high melting temperature. Depending on the target size and material, target prices can vary a lot (e.g., Al1Si target 10 in × 5 mm: $1000; Pt target 10 in × 5 mm: $18,000). All alloys can be deposited using sputtering, depending on the availability of targets for the specific sputtering system. Multilayer structures can be deposited using multiple target sputter equipment with apertures to prevent cross contamination of targets. Chemical compounds (dielectric materials, insulators, metal oxides) can be deposited either using specific compound targets (mostly sintered material) and/or using reactive sputtering. A ty…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. LAYERS DEPOSITED USING SPUTTERING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export