SPUTTER EQUIPMENT


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SPUTTER EQUIPMENT
SPUTTER EQUIPMENTSputtering equipment is available for a variety of different sputtering processes. Ion beam sputtering uses an ion beam to ablate material from a target, which condenses on a substrate. In this case, the ion source is separate from the vacuum chamber in which target and substrate are located. Plasma sputtering constitutes the largest and most common group of sputtering processes and systems. In this case, the ions are generated in the same vacuum chamber as the target and substrate. Plasma sputtering uses ionized gas atoms that are being accelerated toward the target to remove material that condenses on a substrate. Depending on the type of assembly, a triode or diode system is used. The more common diode systems are operated either in DC sputtering with a DC voltage being applied a…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SPUTTER EQUIPMENT, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export