SPUTTERING


Please sign in to view the rest of this entry.

SPUTTERING
SPUTTERING
Definition Sputtering is a plasma process, during which noble gas ions [typically argon (Ar+)] are accelerated toward a target (cathode) from which they remove material particles. These particles build a vapor column that condenses on the substrate. Sputtering is the primary method for the deposition of metallization layers in microelectronics and MEMS. Sputtering is a four-stage process: Stage 1. Creation of ions through collision of inert gas atoms (Ar) with electrons and acceleration of ions toward a target Stage 2
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SPUTTERING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export