LAYERS DEPOSITED USING EVAPORATION AND THEIR PROPERTIES


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LAYERS DEPOSITED USING EVAPORATION AND THEIR PROPERTIES
LAYERS DEPOSITED USING EVAPORATION AND THEIR PROPERTIESEvaporation is primarily used for the deposition of metals. Principally, it allows the nonreactive and reactive deposition of metals, alloys, chemical compounds, and ceramics as single and sandwich layers.Metals. Examples of metal layers deposited are Al, Au, Ag, Cr, Ni/Cr, Ti, Ni, Pt, and Pd. Primarily, e-beam evaporation is used.Alloys. The evaporation of alloys is significantly more difficult than that of metals since the components of alloys seldom have the same vapor pressure at the same temperature. Therefore, sputtering is normally used for alloy deposition.
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. LAYERS DEPOSITED USING EVAPORATION AND THEIR PROPERTIES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export