MOTIVATION AND KEY PROPERTIES


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MOTIVATION AND KEY PROPERTIES
MOTIVATION AND KEY PROPERTIESPVD is the most commonly used process for the deposition of metals and metal oxides in semiconductor and microelectromechanical system (MEMS) processing. The motivation for using PVD processes lies in the specific properties of the process and the deposited layers: A wide range of layer thicknesses ranging from nanometers to micrometers is possible. The layer uniformity and reproducibility is comparably high. Essentially, there is no limitation in the choice of source materials (such as metals, semiconductors, glass, ceramics, composites, oxides, and plastics) that can be deposited.
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. MOTIVATION AND KEY PROPERTIES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export