SUMMARY AND CONCLUSION


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SUMMARY AND CONCLUSION
SUMMARY AND CONCLUSIONSelective removal of material from substrate surface is known as etching. In this chapter, different aspects of the etching process have been discussed. The two figures of merit usually associated with the etching process are selectivity and anisotropy (directionality). If the etching is dominated by chemical reaction between the substrate and the etchant, very good selectivity is obtained. However, the anisotropy is relatively poor as the reaction takes place equally on available surfaces—vertical as well as horizontal. On the other hand, if physical ablation is the dominant etch mechanism, anisotropy is good while the selectivity is poor. Etching can be classified as "wet" and "dry." In wet etching, the substrate is immersed in a chemical solution. As chemical reaction is…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. SUMMARY AND CONCLUSION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export