CONCLUSION


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CONCLUSION
CONCLUSIONAnneals are the most basic thermal treatment in semiconductor processing, but represent the core of thermal processing: heat and ambient control. Concerns for dopant diffusion, wafer defectivity (i.e., slip formation), and by-product outgassing are common to all thermal processes. The intricacies of precise temperature control have developed from basic, batch furnace processing to single wafer active control. The transition from batch throughput to wafer-turnaround time concerns coincides with the miniaturization of device features and the increased limitations on thermal budget. The addition of reactive gases such as oxygen and/or H2O increases considerations for film growth, contamination and defect effects on film properties. Practical application of thermal processing fo…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. CONCLUSION, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export