RAPID THERMAL PROCESSING CONSIDERATIONS


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RAPID THERMAL PROCESSING CONSIDERATIONS
RAPID THERMAL PROCESSING CONSIDERATIONSIndividual or single wafer processing has increased because of more restrictions to thermal budgets allowed for device fabrication, and the desire for fast turn-around time (TAT) in device development. TAT is the time it takes from starting the process on one wafer to starting the process of the next wafer. A typical batch furnace process will take on the order of hours to complete a process, while processing one wafer individually by RTP is typically done in a few minutes or less. Batch furnace processing allows for more thermal stability and process stability time since the throughput has the advantage of processing multiple wafers simultaneously. Disadvantages of batch processing are long thermal exposure time and long overall process ti…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. RAPID THERMAL PROCESSING CONSIDERATIONS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export