THERMAL PROCESSING


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THERMAL PROCESSING
THERMAL PROCESSINGAdvances in technology for thermal processing in semiconductor manufacturing have followed the requirements of the devices being created. In the late 1970s, silicon wafers were relatively small, less than 6 in, and device features were relatively large, with feature sizes as small as 3.0 μm. Hours at elevated temperatures were required to achieve target oxidation thickness, dopant-transfer concentrations and doped-glass flows for planarization. Because each wafer required several hours at temperature, batch furnaces were designed for effective manufacturing of many wafers at the same time. The basics of thermal effects define the thermal-anneal and oxidation processes for the batch furnaces. Heat transfer and temperature control effects on dopant diffusion, slip defects, and oxidat…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. THERMAL PROCESSING, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export