REFERENCES


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REFERENCES
REFERENCES G. V. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani et al., "Design Issues and Considerations for Low-Cost 3-D TSV IC Technology," IEEE Journal of Solid-State Circuits, vol. 46, pp. 293–307, Jan. 2011. J.-M. Koo, S. Im, L. Jiang, and K. E. Goodson, "Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures," Journal of heat transfer, vol. 127, pp. 49–58, 2005. C. M. Fiduccia and R. M. Mattheyses, "A Linear-Time Heuristic for Improving Network Partitions," 19th Conference on Design Auto…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. REFERENCES, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export