CONCLUSIONS AND FUTURE DEVELOPMENTS


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CONCLUSIONS AND FUTURE DEVELOPMENTS
CONCLUSIONS AND FUTURE DEVELOPMENTS3D ICs have provided a revolutionary solution to further boost performance and enhance energy efficiency, other than costly transistor scaling. However, compared to its 2D counterpart, the expanded design space imposes extra design complexities to the physical design domain, including placement, clock tree synthesis, etc. Furthermore, the stacking structure inevitably prolongs the power delivery paths and reduces thermal conductivity, which produces severer voltage drop and higher temperature, respectively. Moreover, TSVs introduce new reliability loss modes. In this chapter, we have provided a comprehensive survey of several challenges that 3D ICs face, and have discussed the state-of-the-art design tool development and management techniques. Furt…
Citation
Hwaiyu Geng, CMfgE, PE: Semiconductor Manufacturing Handbook, Second Edition. CONCLUSIONS AND FUTURE DEVELOPMENTS, Chapter (McGraw-Hill Professional, 2018 2005), AccessEngineering Export