Acknowledgments


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Acknowledgments
AcknowledgmentsDevelopment and preparation of Reliability of RoHS-Compliant 2D and 3D IC Interconnects was facilitated by the efforts of a number of dedicated people. I would like to thank them all, with special mention of Michael McCabe, Michael Mulcahy, Richard Ruzycka, and Stephen Smith of McGraw-Hill, Sapna Rastogi and Shivani Arora of Glyph International, and Lisa McCoy for their unswerving support and advocacy. My special thanks go to Michael Penn and Steve Chapman, who made my dream of this book come true by approving and effectively sponsoring the project, patiently listening to my excuses for delay, and solving many problems that arose during the book’s preparation. It has been a…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Acknowledgments, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export