Preface


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Preface
PrefaceAlmost 30 years ago, when the author was a newcomer in the electronics industry, he believed that, mechanically, solders were very poor at resisting thermal fatigue and should be avoided as joining materials for interconnections. Since then, after assembling many electronic chips and optoelectronic devices on substrates, electronic and optoelectronic packages on printed circuit boards, and three-dimensional (3-D) integrated circuit (IC) integration systems, the author has completely changed his mind about solders as joining materials and greatly appreciates the “convenience” solders provide. Solders have given us remarkable flexibility to interconnect electronics and optoelectronics components. The unique properties of sold…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Preface, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export