Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps


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Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps
1010608Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps
<emphasis role="bold">Introduction</emphasis> Due to the susceptibility of drop (impact) damage on lead-free solder interconnects, the popularity of portable products has led to a greater concern with interconnect performance under high-strain-rate loading conditions. Currently, high-strain-rate behaviors of interconnects have been evaluated using the high-speed shear test on package level or printed circuit board (PCB)-level dro…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export