Electromigration of Lead-Free Microbumps for 3-D IC Integration


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Electromigration of Lead-Free Microbumps for 3-D IC Integration
1010608Electromigration of Lead-Free Microbumps for 3-D IC Integration
<emphasis role="bold">Introduction</emphasis> As mentioned earlier, microbumps are one of the important enabling technologies for three-dimensional (3-D) integrated circuit (IC) integrations, which require thin chips (could go down to 20 μm) in order to be useful and meaningful for stacking up the chips. The ordinary solder bumps (~50 to 100 μm) are too big for 3-D IC integrations, which require much smaller bumps (25 μm or les…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Electromigration of Lead-Free Microbumps for 3-D IC Integration, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export