Through-Silicon-Via (TSV) Interposer Reliability


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Through-Silicon-Via (TSV) Interposer Reliability
1010608Through-Silicon-Via (TSV) Interposer Reliability
<emphasis role="bold">Introduction</emphasis> As mentioned in Chap. 1, the through-silicon-via (TSV) [
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Through-Silicon-Via (TSV) Interposer Reliability, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export