Reliability of Lead-Free (SACX) Solder Joints


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Reliability of Lead-Free (SACX) Solder Joints
10313001010608Reliability of Lead-Free (SACX) Solder Joints
<emphasis role="bold">Introduction</emphasis> The effect of a very low level of doping of Ce (cerium) on the SnAgCu solder is presented. Emphasis is placed on the determination of the material properties (such as the temperature and strainrate–dependent Young’s modulus, yield stress, ultimate strength, and the temperature- and time-dependent creep) and the intermetallic compounds (IMC) on organic solderability p…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Reliability of Lead-Free (SACX) Solder Joints, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export