Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints


Please sign in to view the rest of this entry.

Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints
10313001010608Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints
<emphasis role="bold">Introduction</emphasis> In this chapter, the practical aspects of using a lower-melting-point, lead-free solder paste, Sn-57wt%Bi-1wt%Ag, are presented. A number of niche assembly applications cannot withstand the processing temperature range of 230°C to 260°C required for SnAgCu assemblies [
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export