Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills)


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Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills)
10313001010608Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills)
<emphasis role="bold">Introduction</emphasis> The plastic ball grid array (PBGA) package was invented by Motorola in the early 1990s, and has had significant effects on semiconductor packaging assemblies and tests [
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills), Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export