Reliability of 1657-Pin CCGA Lead-Free Solder Joints


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Reliability of 1657-Pin CCGA Lead-Free Solder Joints
10313001010608Reliability of 1657-Pin CCGA Lead-Free Solder Joints
<emphasis role="bold">Introduction</emphasis> In many applications, such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The ceramic column grid array (CCGA) package developed by IBM is one of the best candidates for housing these kinds of chips [
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Reliability of 1657-Pin CCGA Lead-Free Solder Joints, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export