Reliability Engineering of Lead-Free Interconnects


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Reliability Engineering of Lead-Free Interconnects
10313001010608Reliability Engineering of Lead-Free Interconnects
<emphasis role="bold">Introduction</emphasis> Many people in the electronic industry like to use the word “reliability”—especially the people in packaging (e.g., solder-bump reliability of the first-level interconnects), printed circuit board (PCB) assembly (e.g., solder-joint reliability of the second-level interconnects), and now 3-D IC integration (e.g., microbump reliability of the stacked-chip int…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Reliability Engineering of Lead-Free Interconnects, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export