About the Author


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<emphasis role="bold">About the Author</emphasis>
<emphasis role="bold">About the Author</emphasis>John H. Lau, Ph.D., has been an ITRI Fellow of the Industrial Technology Research Institute (ITRI in Taiwan) since January 2010. Prior to that, he was a visiting professor at HKUST (Hong Kong University of Science & Technology) for 1 year; the Director of the Microsystems, Modules, and Components (MMC) Laboratory at the Institute of Microelectronics (IME in Singapore) for 2 years; and a Senior Scientist/MTS at HP/Agilent in California for more than 25 years.Dr. Lau’s professional competences are design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. About the Author, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export