Introduction to RoHS-Compliant Semiconductor and Packaging Technologies


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Introduction to RoHS-Compliant Semiconductor and Packaging Technologies
1010608Introduction to RoHS-Compliant Semiconductor and Packaging Technologies
<emphasis role="bold">Introduction</emphasis> The RoHS-compliant semiconductor and 3-D integration technologies are briefly presented and discussed in this chapter. Three-dimensional integration consists of 3-D integrated circuit (IC) packaging, 3-D IC integration, and 3-D Si integration. They are different—in general, the TSV (through-silicon-via) separates the 3-D IC packaging and 3-D IC/Si integrations, that i…
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Introduction to RoHS-Compliant Semiconductor and Packaging Technologies, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export