LAND GRID ARRAY INTERCONNECT


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LAND GRID ARRAY INTERCONNECT
1010608LAND GRID ARRAY INTERCONNECTGary M. FreedmanHewlett-Packard Corporation, Business Critical Systems, Singapore
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> The land grid array (LGA) device is a solder-less package that relies upon pressure contact to interconnect it to the board mechanically and electrically. Interconnection is accomplished through a socket or interposer that is sandwiched between …
Citation
Clyde F. Coombs, Jr.: Printed Circuits Handbook, Sixth Edition. LAND GRID ARRAY INTERCONNECT, Chapter (McGraw-Hill Professional, 2008), AccessEngineering Export