SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS


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SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS
SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS David W. Bergman (IPC)-Association Connecting Electronics Industries, Bannockburn, Illinois The following documents center on surface-mount technology. These documents have been developed by standards organizations in the United States and internationally. The letters in each document designation indicate the organization that has responsibility for the document:ECA: Doc…
Citation
Clyde F. Coombs, Jr.: Printed Circuits Handbook, Sixth Edition. SUMMARY OF KEY COMPONENT, MATERIAL, PROCESS, AND DESIGN STANDARDS, Chapter (McGraw-Hill Professional, 2008), AccessEngineering Export