ADVANCED COMPONENT PACKAGING


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ADVANCED COMPONENT PACKAGING
1010608ADVANCED COMPONENT PACKAGINGTarak A. Railkar, Ph.D.Texas Instruments, Inc., Dallas, TexasSimon Ang, Ph.D.High Density Electronics Center, Department of Electrical Engineering, University of Arkansas, Fayetteville, ArkansasWilliam Brown, Ph.D.High Density Electronics Center, Department of Electrical Engineering, University of Arkansas, Fayetteville, Arkansas
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Citation
Clyde F. Coombs, Jr.: Printed Circuits Handbook, Sixth Edition. ADVANCED COMPONENT PACKAGING, Chapter (McGraw-Hill Professional, 2008), AccessEngineering Export