Microprocessor Packaging


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Microprocessor Packaging
1010602Microprocessor Packaging
<emphasis role="bold">Overview</emphasis> This chapter discusses how completed die are packaged for use. The chapter describes the trade-offs of different types of packages and presents an example package assembly flow.
<emphasis role="bold">Objectives</emphasis> Upon completion of this chapter the reader will be able to:
Citation
Grant McFarland: Microprocessor Design: A Practical Guide from Design Planning to Manufacturing. Microprocessor Packaging, Chapter (McGraw-Hill Professional, 2006), AccessEngineering Export