To use this personalized feature, you need to be signed into your user account.
- Select some text
- Click the icon
MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export