MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs


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MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs
10306001010608MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Electrically conductive adhesives (ECAs) will be used as a replacement for traditional tin-lead (SnPb) solders. Compared to SnPb solder, ECA technology offers numerous advantages including environmental friendliness, fine pitch capability, better thermomechanical properties, fewer processing steps, n…
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. MECHANISMS UNDERLYING THE UNSTABLE CONTACT RESISTANCE OF ECAs, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export