INTRODUCTION TO CONDUCTIVE ADHESIVES


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INTRODUCTION TO CONDUCTIVE ADHESIVES
10306001010608INTRODUCTION TO CONDUCTIVE ADHESIVESThis chapter gives a brief overview of packaging technologies, trends in electronics packages, and conductive adhesive technology, and also introduces the scope and nature of the following chapters. The intent is to provide a fundamental understanding of ECA technology and to develop high-performance conductive adhesives for solder replacement. This chapter also includes a detailed outline of the research goals and selected approaches to gaining a fundamental understanding and developing solder replacement conductive adhesives.
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. INTRODUCTION TO CONDUCTIVE ADHESIVES, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export