CHALLENGES FOR LEAD-FREE SOLDERING


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CHALLENGES FOR LEAD-FREE SOLDERING
10306001010608CHALLENGES FOR LEAD-FREE SOLDERINGThe implementation of lead-free soldering is not a smooth ride. Challenges surface one by one in all aspects, including surface finishes, soldering processes, and reliability. In general, most of the challenges can be answered with certain approaches, although some of those approaches remain hypothetical or theoretical. However, some challenges still remain unanswered. In this chapter, most of the challenges encountered in lead-free soldering are listed and discussed.
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Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. CHALLENGES FOR LEAD-FREE SOLDERING, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export