ABOUT THE AUTHORS


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ABOUT THE AUTHORS
ABOUT THE AUTHORSJohn H. Lau received his PhD in theoretical and applied mechanics from the University of Illinois, an MASc in structural engineering from the University of British Columbia, a second MS in engineering physics from the University of Wisconsin, and a third MS in management science from Fairleigh Dickinson University. He also has a BE in civil engineering from National Taiwan University. John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of optoelectronic packaging and manufacturing technology.Prior to coming to Agilent, Lau worked for Express Packaging Systems, Hewle…
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. ABOUT THE AUTHORS, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export