CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS


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CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS
10306001010608CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> The lead-free solder bumps discussed in Chaps. 2 and 3 are just one of many different kinds of chip (wafer)-le…
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export