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CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. CHIP (WAFER)-LEVEL INTERCONNECTS WITH SOLDERLESS BUMPS, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export