WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE


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WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE
10306001010608WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> The solder joint reliability of various wafer-level chip-scale packages (WLCSPs) on organic printed circuit board (PCB)/substrate is the focus of discussion in this chapter,
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. WLCSP WITH LEAD-FREE SOLDER BUMPS ON PCB/SUBSTRATE, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export