CHIP- (WAFER)- LEVEL INTERCONNECTS WITH LEAD-FREE SOLDER BUMPS


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CHIP- (WAFER)- LEVEL INTERCONNECTS WITH LEAD-FREE SOLDER BUMPS
10306001010608CHIP- (WAFER)- LEVEL INTERCONNECTS WITH LEAD-FREE SOLDER BUMPS
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Alternative material systems for lead-free solders 1
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. CHIP- (WAFER)- LEVEL INTERCONNECTS WITH LEAD-FREE SOLDER BUMPS, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export