PREFACE


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PREFACE
PREFACEWhy did we want to write this book? Was it because of fear: fear of (potential) legislation, fear of trade barriers, fear of competition? Absolutely not! We wrote this book for ourselves, our children, and their children, so that we will all have a greener environment to live in!Books of this type can be huge and contain many different viewpoints, e.g., political, economic, cultural, and infrastructural. However, emphasis in this book is placed on fundamental principles, engineering data, and manufacturing technologies. There are four major subjects in this book: integrated circuit (IC) packaging (Chaps.
Citation
John H. Lau; C.P. Wong; Ning-Cheng Lee; Shi-Wei Ricky Lee: Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. PREFACE, Chapter (McGraw-Hill Professional, 2003), AccessEngineering Export