Electronic Packaging and Interconnection Series


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Electronic Packaging and Interconnection Series
Electronic Packaging and Interconnection Series Charles M. Harper, Series Advisor ALVINO ▪ Plastics for Electronics CLASSON ▪ Surface Mount Technology for Concurrent Engineering and Manufacturing G. DI GIACOMO ▪ Reliability of Electronic Packages and Semiconductor Devices GINSBERG AND SCHNOOR ▪ Multichip Module and Related Technologies HARM…
Citation
Perry L. Martin: Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies. Electronic Packaging and Interconnection Series, Chapter (McGraw-Hill Professional, 1999), AccessEngineering Export