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Foreword Jan VardamanTechsearch
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Just as the semiconductor industry has seen a dramatic shift from through-hole to surface-mount packages, another major change is underway—the shift from leads to balls and from wires to bumps. Ball grid array (BGA) packages are increasingly found in products including personal computers, portable communications devices, workstations/servers, midrange and high-end compu…
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. Foreword, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export