MOLDING FOR AREA ARRAY PACKAGES


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MOLDING FOR AREA ARRAY PACKAGES
1010608MOLDING FOR AREA ARRAY PACKAGESK. GilleoCookson ElectronicsB. CottermanCookson Semiconductor Packaging Materials
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis>
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. MOLDING FOR AREA ARRAY PACKAGES, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export