DIE ATTACH AND REWORK


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DIE ATTACH AND REWORK
1010608DIE ATTACH AND REWORKKen GilleoCookson Electronics
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> The semiconductor die or chip typically is bonded to a substrate for several critical reasons. First, an unattached die is subject to much greater mechanical abuse during handling of the package and assembly du…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. DIE ATTACH AND REWORK, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export