BGA ASSEMBLY RELIABILITY


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BGA ASSEMBLY RELIABILITY
1010608BGA ASSEMBLY RELIABILITYRaza GhaffarianJet Propulsion Laboratory
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> The dominant trend within electronics today is the drive toward increasingly smaller feature sizes on integrated circuit (IC) chips. Ten years ago, feature sizes of 1 ┬Ám were the norm; by the m…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. BGA ASSEMBLY RELIABILITY, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export