ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLDER?


Please sign in to view the rest of this entry.

ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLDER?
1010608ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLDER?Ken GilleoCookson ElectronicsDavid BlumelMcGraw-Hill Companies
<emphasis role="italic"><emphasis role="bold">…</emphasis></emphasis>
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE-MOUNT AND FLIP CHIP PROCESSES: AN ALTERNATIVE TO SOLDER?, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export