MEMS PACKAGING AND ASSEMBLY CHALLENGES


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MEMS PACKAGING AND ASSEMBLY CHALLENGES
1010608MEMS PACKAGING AND ASSEMBLY CHALLENGESKen GilleoCookson Electronics
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Microelectromechanical system (MEMS) may just be the ultimate enabling technology for the micro-level integration long sought for advanced pro…
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. MEMS PACKAGING AND ASSEMBLY CHALLENGES, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export