STACKED/3D PACKAGES


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STACKED/3D PACKAGES
1010608STACKED/3D PACKAGESLee SmithAmkor Technology, Inc.
<emphasis role="italic"><emphasis role="bold">INTRODUCTION</emphasis></emphasis> Industry experts believe that the fourth wave of semiconductor package innovation is being driven by challenging new electronic applications. The term application-specific packaging
Citation
Ken Gilleo; Jan Vardaman: Area Array Packaging Handbook: Manufacturing and Assembly. STACKED/3D PACKAGES, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export