Preface


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Preface
PrefaceThe last decade witnessed an explosive growth in research and development efforts devoted to advanced microelectro-mechanical systems (MEMS) packaging as a direct result of higher requirements for package footprint, density, and performance and cost advantages over conventional MEMS packages. For the next decade, MEMS devices and packaging will penetrate into IT, telecommunications, automotive, life sciences, medical, and implantable applications. However, like many other new technologies, advanced MEMS packaging still has many critical issues that need to be addressed. In the development of advanced MEMS packaging, the following must be noted and understood: The infrastructure of MEMS devices and MEMS packaging is not well est…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Preface, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export