Acknowledgments


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Acknowledgments
AcknowledgmentsDevelopment and preparation of Advanced MEMS Packaging was facilitated by the efforts of a number of dedicated people. We would like to thank them all, with special mention to Michael Mulcahy of McGraw-Hill and Somya Rustagi of Glyph International for their unswerving support and advocacy. Our special thanks go to Taisuke Soda and Steve Chapman of McGraw-Hill, who made our dream of this book come true by effectively sponsoring the project, patiently listening to our excuses for delay, and solving many problems that arose during the book’s preparation. It has been a great pleasure and fruitful experience to work with all of them in transferring our messy manuscripts into a very …
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Acknowledgments, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export